- Manufacturer：
-
- CUI Devices (1)
- Ohmite (4)
- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 AL... |
-
|
1,288
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
-
|
8,982
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-220,TO... |
-
|
4,860
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
-
|
162
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
-
|
3,000
In-stock
|
Get Quote | ||
|
|
Seeed Technology Co., Ltd | RASPBERRY PI COO... |
-
|
126
In-stock
|
Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | 65715 EXTRUSION 0.39X... |
-
|
153
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
-
|
3,000
In-stock
|
Get Quote |
