- Manufacturer：
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- CUI Devices (2)
- Type：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
-
|
16,461
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
-
|
749
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
-
|
3,000
In-stock
|
Get Quote |
