- Manufacturer：
-
- CUI Devices (4)
- WEC (1)
- Attachment Method：
-
- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
-
|
1,974
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
-
|
2,009
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
-
|
432
In-stock
|
Get Quote | ||
|
|
WEC | HEAT SINK, EXTRUS... |
-
|
930
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
-
|
3,000
In-stock
|
Get Quote |
