- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
-
|
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
-
|
3,000
In-stock
|
Get Quote |
