- Manufacturer：
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- Bergquist (1)
- Shape：
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- Usage：
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- Thermal Conductivity：
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- Backing, Carrier：
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- Thermal Resistivity：
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4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Bergquist | BERGQUIST GAP PA... |
-
|
2
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | TFLEX SF860 |
-
|
8
In-stock
|
Get Quote | ||
|
|
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
-
|
3,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies EMI | COOLZORB-ULTRA,0.... |
-
|
14
In-stock
|
Get Quote |
