251-5949-51-0602

Manufacturer :

3M

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

30.0µin (0.76µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polysulfone (PSU), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

51 (1 x 25, 1 x 26)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.050" (1.27mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

Zig-Zag, ZIF (ZIP)