DS70830AN80BGV

Mfr.Part #
DS70830AN80BGV
Manufacturer
Renesas Electronics America Inc
Package/Case
-
Datasheet
Download
Description
IC DS70830AN80BGV
Stock
3000

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Manufacturer :
Renesas Electronics America Inc
Product Category :
Embedded - Microcontrollers
Connectivity :
EBI/EMI, FIFO, I²C, SCI, SSU, UART/USART
Core Processor :
SH-2
Core Size :
32-Bit Single-Core
Data Converters :
A/D 8x10b SAR
EEPROM Size :
-
Mounting Type :
Surface Mount
Number of I/O :
65
Operating Temperature :
-20°C ~ 85°C (TA)
Oscillator Type :
Internal
Package / Case :
112-LFBGA
Peripherals :
DMA, POR, PWM, WDT
Product Status :
Last Time Buy
Program Memory Size :
-
Program Memory Type :
ROMless
RAM Size :
16K x 8
Speed :
80MHz
Supplier Device Package :
112-LFBGA (10x10)
Voltage - Supply (Vcc/Vdd) :
3V ~ 5.5V
Datasheets
DS70830AN80BGV

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