HSB25-282810

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Push Pin

Diameter :

-

Fin Height :

0.394" (10.00mm)

Length :

1.122" (28.50mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

4.87W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

5.10°C/W @ 200 LFM

Thermal Resistance @ Natural :

15.41°C/W

Type :

Top Mount

Width :

1.122" (28.50mm)